Thin Film Interconnects

Early Stage
Breakthrough Technology in Semiconductor Industry Manufacturing
Overview
Raised: $122,850
Rolling Commitments ($USD)
Status
Active
Reporting Date
03/26/2023
Days Remaining
5
% of Min. Goal
123%
% of Max. Goal
11%
Likelihood of Max
Avg. Daily Raise
$156
Momentum
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Year Founded
2018
Industry
Industrial Services
Tech Sector
Hardwaretech
Distribution Model
B2B
Margin
Low
Capital Intensity
High
Thin Film Interconnects, with a pre-money valuation of $13 million, is raising crowdfunding on Title3Funds. The company is disrupting the semiconductor industry with its new technology, Through Silicon Via. The technology interconnects devices to devices and chips to chips through vertical holes filled with copper. Tae Young Lee founded Thin Film Interconnects in May 2018. The proceeds of the current crowdfunding round, with a minimum raise of $100,000 and a maximum raise of $1,070,000, will be used for growth and expansion. Thin Film Interconnects aims to overcome problems and issues of the current PVD and sputtering process and equipment limitations.
Summary Profit and Loss Statement
Most Recent Year | Prior Year | |
---|---|---|
Revenue |
$0 |
$0 |
COGS |
$0 |
$0 |
Tax |
$800 |
$0 |
| ||
| ||
Net Income |
$-35,895 |
$-9,590 |
Summary Balance Sheet
Most Recent Year | Prior Year | |
---|---|---|
Cash |
$0 |
$0 |
Accounts Receivable |
$0 |
$0 |
Total Assets |
$0 |
$0 |
Short-Term Debt |
$0 |
$0 |
Long-Term Debt |
$0 |
$0 |
Total Liabilities |
$0 |
$0 |
Financials as of: 01/25/2021
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