Thin Film Interconnects
Early Stage
Breakthrough Technology in Semiconductor Industry Manufacturing
Overview
Raised: $123,350
Total Commitments ($USD)
Platform
Title3Funds
Start Date
01/24/2021
Close Date
02/24/2025
Min. Goal
$100,000
Max. Goal
$1,070,000
Min. Investment
$500
Security Type
Equity - Common
Series
Pre-Seed
SEC Filing Type
RegCF
Price Per Share
$10.00
Pre-Money Valuation
$13,000,000
Rolling Commitments ($USD)
Status
Active
Reporting Date
04/25/2024
Days Remaining
304
% of Min. Goal
123%
% of Max. Goal
12%
Likelihood of Max
Avg. Daily Raise
$104
Momentum
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Year Founded
2018
Industry
Industrial Services
Tech Sector
Hardwaretech
Distribution Model
B2B
Margin
Low
Capital Intensity
High
Thin Film Interconnects, with a pre-money valuation of $13 million, is raising crowdfunding on Title3Funds. The company is disrupting the semiconductor industry with its new technology, Through Silicon Via. The technology interconnects devices to devices and chips to chips through vertical holes filled with copper. Tae Young Lee founded Thin Film Interconnects in May 2018. The proceeds of the current crowdfunding round, with a minimum raise of $100,000 and a maximum raise of $1,070,000, will be used for growth and expansion. Thin Film Interconnects aims to overcome problems and issues of the current PVD and sputtering process and equipment limitations.
Summary Profit and Loss Statement
| Most Recent Year | Prior Year | |
|---|---|---|
|
Revenue |
$0 |
$0 |
|
COGS |
$0 |
$0 |
|
Tax |
$800 |
$0 |
| ||
| ||
|
Net Income |
$-35,895 |
$-9,590 |
Summary Balance Sheet
| Most Recent Year | Prior Year | |
|---|---|---|
|
Cash |
$0 |
$0 |
|
Accounts Receivable |
$0 |
$0 |
|
Total Assets |
$0 |
$0 |
|
Short-Term Debt |
$0 |
$0 |
|
Long-Term Debt |
$0 |
$0 |
|
Total Liabilities |
$0 |
$0 |
Financials as of: 01/24/2021
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