Thin Film Interconnects

Thin Film Interconnects

Open  for investment

About this raise

Thin Film Interconnects, with a pre-money valuation of $13 million, is raising crowdfunding on Title3Funds. The company is disrupting the semiconductor industry with its new technology, Through Silicon Via. The technology interconnects devices to devices and chips to chips through vertical holes filled with copper. Tae Young Lee founded Thin Film Interconnects in May 2018. The proceeds of the current crowdfunding round, with a minimum raise of $100,000 and a maximum raise of $1,070,000, will be used for growth and expansion. Thin Film Interconnects aims to overcome problems and issues of the current PVD and sputtering process and equipment limitations.

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Investment Overview

Committed this round: $0

Deal Terms

Total Commitments ($USD)

Platform
Title3Funds
Start Date
01/25/2021
Close Date
02/24/2025
Min. Goal
$100,000
Max Goal
$1,070,000
Min. Investment

$100

Security Type

Equity - Common

Series

Pre-Seed

SEC Filing Type

RegCF    Open SEC Filing

Price Per Share

$10.00

Pre-Money Valuation

$13,000,000

Company & Team

Company

Year Founded
2018
Industry
Industrial Services
Tech Sector
Hardwaretech
Distribution Model
B2B
Margin
Low
Capital Intensity
High
Location
Thousand Oaks, California
Business Type
High Growth
Company Website
Visit Website

Team

Employees
5
Prior Founder Exits?
No
Founder Name
Ty Lee
Title
President

Funding data not publicly available

Financials

 Revenue
$0
 Monthly Burn
$2,991
 Runway
0 months

Summary Profit and Loss Statement

Most Recent Year Prior Year

Revenue

$0

$0

COGS

$0

$0

Tax

$800

$0

 

 

Net Income

$-35,895

$-9,590

Summary Balance Sheet

Most Recent Year Prior Year

Cash

$0

$0

Accounts Receivable

$0

$0

Total Assets

$0

$0

Short-Term Debt

$0

$0

Long-Term Debt

$0

$0

Total Liabilities

$0

$0

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Company Funding & Growth

Funding history

Close Date Platform Valuation Total Raised Security Type Status Reg Type
02/24/2025 Title3Funds $13,000,000 $0 Equity - Common Active RegCF
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Add to portfolio
Thin Film Interconnects on Title3Funds
Platform: Title3Funds
Security Type: Equity - Common
Valuation: $13,000,000
Price per Share: $10.00

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