Thin Film Interconnects
About this raise
Thin Film Interconnects, with a pre-money valuation of $13 million, is raising crowdfunding on Title3Funds. The company is disrupting the semiconductor industry with its new technology, Through Silicon Via. The technology interconnects devices to devices and chips to chips through vertical holes filled with copper. Tae Young Lee founded Thin Film Interconnects in May 2018. The proceeds of the current crowdfunding round, with a minimum raise of $100,000 and a maximum raise of $1,070,000, will be used for growth and expansion. Thin Film Interconnects aims to overcome problems and issues of the current PVD and sputtering process and equipment limitations.
Investment Overview
Committed $0 :
Deal Terms
Company & Team
Company
- Year Founded
- 2018
- Industry
- Industrial Services
- Tech Sector
- Distribution Model
- B2B
- Margin
- Low
- Capital Intensity
- High
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Company Funding & Growth
Funding history
Close Date | Platform | Valuation | Total Raised | Security Type | Status | Reg Type |
---|---|---|---|---|---|---|
02/24/2025 | Title3Funds | $13,000,000 | $0 | Equity - Common | Active | RegCF |