Thin Film Interconnects

Early Stage

Breakthrough Technology in Semiconductor Industry Manufacturing

Analytics

Raised to Date: Raised: $111,000

Aggregate Commitments $

Platform

Title3Funds

Start Date

01/25/2021

Close Date

02/24/2022

Min. Goal

$100,000

Max. Goal

$1,070,000

Min. Investment

$500

Security Type

Equity - Common

Funding Type

RegCF

Series

Pre-Seed

Pre-Money Valuation

$13,000,000

Rolling Commitments $

Status

Active

Reporting Date

01/27/2022

Days Remaining

28

% of Min. Goal

111%

% of Max. Goal

10%

Likelihood of Max
unlikely
Avg. Daily Raise

$302

Momentum
cold.svg
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Location

Thousand Oaks, California

Industry

Industrial Services

Tech Sector

Hardwaretech

Distribution Model

B2B

Margin

Low

Capital Intensity

High

Business Type

High Growth

Thin Film Interconnects, with a pre-money valuation of $13 million, is raising crowdfunding on Title3Funds. The company is disrupting the semiconductor industry with its new technology, Through Silicon Via. The technology interconnects devices to devices and chips to chips through vertical holes filled with copper. Tae Young Lee founded Thin Film Interconnects in May 2018. The proceeds of the current crowdfunding round, with a minimum raise of $100,000 and a maximum raise of $1,070,000, will be used for growth and expansion. Thin Film Interconnects aims to overcome problems and issues of the current PVD and sputtering process and equipment limitations.

Summary Profit and Loss Statement

Most Recent Year Prior Year

Revenue

$0

$0

COGS

$0

$0

Tax

$800

$0

 

 

Net Income

$-35,895

$-9,590

Summary Balance Sheet

Most Recent Year Prior Year

Cash

$0

$0

Accounts Receivable

$0

$0

Total Assets

$0

$0

Short-Term Debt

$0

$0

Long-Term Debt

$0

$0

Total Liabilities

$0

$0

Financials as of: 01/25/2021
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Thin Film Interconnects on Title3Funds
$
Platform: Title3Funds
Security Type: Equity - Common
Valuation: $13,000,000

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