Thin Film Interconnects

Thin Film Interconnects

Early Stage

Breakthrough Technology in Semiconductor Industry Manufacturing

Breakthrough Technology in Semiconductor Industry Manufacturing

Overview

Raised to Date: Raised: $122,850

Total Commitments ($USD)

Platform

Title3Funds

Start Date

01/25/2021

Close Date

02/24/2024

Min. Goal
$100,000
Max. Goal
$1,070,000
Min. Investment

$500

Security Type

Equity - Common

Series

Pre-Seed

SEC Filing Type

RegCF    Open SEC Filing

Price Per Share

$10.00

Pre-Money Valuation

$13,000,000

Rolling Commitments ($USD)

Status

Active

Reporting Date

11/29/2023

Days Remaining

87

% of Min. Goal

123%

% of Max. Goal

11%

Likelihood of Max
unlikely
Avg. Daily Raise

$118

Momentum
cold.svg
Create a free account today to gain access to KingsCrowd analytics.
Year Founded

2018

Industry

Industrial Services

Tech Sector

Hardwaretech

Distribution Model

B2B

Margin

Low

Capital Intensity

High

Location

Thousand Oaks, California

Business Type

High Growth

Thin Film Interconnects, with a pre-money valuation of $13 million, is raising crowdfunding on Title3Funds. The company is disrupting the semiconductor industry with its new technology, Through Silicon Via. The technology interconnects devices to devices and chips to chips through vertical holes filled with copper. Tae Young Lee founded Thin Film Interconnects in May 2018. The proceeds of the current crowdfunding round, with a minimum raise of $100,000 and a maximum raise of $1,070,000, will be used for growth and expansion. Thin Film Interconnects aims to overcome problems and issues of the current PVD and sputtering process and equipment limitations.

Summary Profit and Loss Statement

Most Recent Year Prior Year

Revenue

$0

$0

COGS

$0

$0

Tax

$800

$0

 

 

Net Income

$-35,895

$-9,590

Summary Balance Sheet

Most Recent Year Prior Year

Cash

$0

$0

Accounts Receivable

$0

$0

Total Assets

$0

$0

Short-Term Debt

$0

$0

Long-Term Debt

$0

$0

Total Liabilities

$0

$0

Financials as of: 01/25/2021
Create a free account today to gain access to KingsCrowd analytics.

Upgrade to gain access

Pay Monthly
Annually (Save 17%)

Edge

$25 /month
billed annually
Free portfolio tracking, data-driven ratings, AI analysis and reports
Plan Includes:
Everything in Free, plus
Company specific KingsCrowd ratings and analyst reports
Deal explorer and side-by-side comparison
Startup exit and failure tracking
Startup market filters and historical industry data
Advanced company search ( with ratings)
Get Edge Annual
Already a member? Log in here.

Ratings KingsCrowd Startup Rating Methodology Article

Blurred Ratings Bars Blurred Ratings Bars
Founders: enhance your startup's credibility on KingsCrowd. Create an account to claim this raise page.

Create your first portfolio

Create your own startup investment portfolio on KingsCrowd.

Track all of your startup investments in one place using our state-of-the-art portfolio tracker tools. To begin, create your first portfolio below.

Add to portfolio
Thin Film Interconnects on Title3Funds
Platform: Title3Funds
Security Type: Equity - Common
Valuation: $13,000,000
Price per Share: $10.00

Follow company

Follow Thin Film Interconnects on Title3Funds

Buy Thin Film Interconnects's Deal Report

Thin Film Interconnects Deal Report

Get KingsCrowd’s comprehensive report on Thin Film Interconnects including:

  • How our proprietary algorithm rates their current capital raise (1-5 stars)
  • Detailed price, market, team, differentiators, performance, and risk ratings
  • Whether Thin Film Interconnects is undervalued or overvalued
  • Scores on the founding team and key personnel's background and expertise

Buy the Thin Film Interconnects deal report for only $10!

Email address:
Looking to buy more than one deal report? Get unlimited reports by upgrading to Edge